Secure Smart Cards : Low temperature injected encapsulation of electronic elements protects against heat, chemical, and physical attacks
CardXX displayed its contactless, contacted, dual-interface, dual-frequency, and synthetic paper cards at the CardTech/SecureTech Technology Conference in Washington, DC.
CardXX manufactures and licenses secure and intelligent smart cards using its proprietary, patented low temperature and low pressure encapsulation process known as the Reaction Assisted Molded Process (RAMP). RAMP is used to securely integrate a Radio Frequency Identification chip and antennae, an integrated circuit, and other electronic components including batteries into a small form factor smart card or smart tag. The process can also be used to produce MMC and SD cards. "As a result of the progress that has been made over the last six months, we are now in a position to begin producing batch quantity orders for customers", commented Paul Lewis, CardXX's CEO and President. "As we move forward, we will seek partnerships with industry leading companies to take our technology to the market."
CardXX has developed patented technologies to securely encapsulate electronics into smart cards and other portable devices or form factors. CardXX partnered with Spyrus to engineer the first smart card to receive certification from the National Institute of Standards and Technology (NIST) for Overall Level 3 compliance, including Physical Security with the Federal Information Processing Standard (FIPS) 140 - Security Requirements for Cryptographic Modules.
The CardXX process offers the following unique advantages:
|April 22, 2004||© Yenra ®|